U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.
The Orion capsule’s splashdown in the Pacific Ocean moved NASA into the next stages of the Artemis program, which will rely on Elon Musk’s rocket company to build a moon lander for astronauts. https://nyti.ms/3YcuUYn
Some of the industry’s critics are skeptical, however, about a new flexibility to changes to Section 230 of the Communications Decency Act. https://nyti.ms/34ey2si
The digital media company, which will merge with a publicly listed shell company in what is known as a SPAC deal, also lined up about $150 million in debt financing. https://nyti.ms/2SXcq1k
