U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.
In a rare in-depth interview, this billionaire man of mystery, the head of Palantir Technologies, talks about war, A.I. and America’s future. https://nyti.ms/3WOsRK7
Robert Tymofichuk, a teacher in Alberta, Canada, spent nearly 2,000 hours building an operational hovercraft from salvaged car parts and with no blueprint. https://www.nytimes.com/2024/09/21/technology/diy-hovercraft-alberta-canada.html?utm_source=dlvr.it&utm_medium=blogger