U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.
In a rare in-depth interview, this billionaire man of mystery, the head of Palantir Technologies, talks about war, A.I. and America’s future. https://nyti.ms/3WOsRK7
The digital media company, which will merge with a publicly listed shell company in what is known as a SPAC deal, also lined up about $150 million in debt financing. https://nyti.ms/2SXcq1k
